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[Data] WTI Blog April 2022

Introducing topics such as 'Standards for the external dimensions of semiconductor packages' and 'Is it true that current can become a vortex?'

This document summarizes the WTI blog of Wave Technology Co., Ltd., which is a "development and design promotion business" aimed at solving the shortage of engineers, from April 5, 2022, to April 26, 2022. It introduces topics such as "About the dimensional standards of semiconductor packages" from April 5, 2022, and "Is it true that current becomes a whirlpool?" from April 26, 2022. In addition, it includes a wealth of useful information related to products and industries. We encourage you to read it. [Contents] ■ April 5, 2022: "About the dimensional standards of semiconductor packages" ■ April 12, 2022: Inquiry case studies from substrate manufacturers (sequel) ~ Substrate design also requires adjustments that align with the manufacturing processes of substrate manufacturers ~ ■ April 19, 2022: An era where services are utilized for tasks other than those that the company should focus on ■ April 26, 2022: Is it true that current becomes a whirlpool? *For more details, please refer to the PDF document or feel free to contact us.

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11/5 Webinar Basics of Semiconductor Packaging and Quality Control

Systematically acquire semiconductor packaging technology from the basics. Learn about quality control and the latest packaging trends in one day.

■Title: "Fundamentals of Semiconductor Packaging, Quality Control, and Latest Trends" ――This course systematically explains the functions and structures required for semiconductor packaging, manufacturing processes, and quality control, as well as the latest technological trends such as SiP, WLP, FOWLP, TSV, chipletization, and three-dimensional packaging. Participants will gain an understanding of the overall picture of packaging technology and practical challenges, acquiring the knowledge necessary for semiconductor development and manufacturing. - Functions required for semiconductor packaging and technological transitions - Characteristics, challenges, and countermeasures of each subsequent process - Basic knowledge of package quality control - Advanced packaging technologies such as SiP, WLP, FOWLP, and TSV - Latest trends in chipletization and three-dimensional packaging - Understanding the interrelation of materials, equipment, and packaging technology - Young engineers related to packaging technology - Engineers from semiconductor equipment manufacturers and material suppliers - Sales and marketing personnel - Individuals who wish to systematically acquire knowledge related to semiconductors

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